DIFF Subgroup Additional Only
H05K 2203/043 Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Soldering or other types of metallurgic bonding > Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Top Applicants
Top Applicants (IPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,201
- PANASONIC INTELLECTUAL PROPERTY 6,828
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
- LG ELECTRONICS KR 3,564
- PANASONIC INTELLECTUAL PROPERTY JP 3,533
- SAMSUNG DISPLAY KR 3,310
- FUJI JP 2,870
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
- MURATA MANUFACTURING COMPANY JP 2,634
Top Applicants (CPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907