H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Introduced: September 1968
Description
Covers the design, manufacture, and assembly of printed circuit boards (PCBs), including circuit patterns, substrate materials, and interconnection technologies. Encompasses mechanical casings, enclosures, and structural components that house electrical apparatus, as well as manufacturing processes for assembling discrete electrical and electronic components onto circuit boards. Addresses thermal management, insulation, shielding, and interconnection methods for electronic equipment.
Additional Content IPC
printed circuit printed circuits The expression covers all kinds of mechanical arrangements of circuits that consist of an insulating base or substrate, having at least one conductive layer permanently formed on the base. The base often extends in a two-dimensional [2D] plane. Other conductive layers may be formed in a layer structure within the base. The base may support components on its surface or between its layers. Each conductive layer is formed as separate patterns or tracks to connect the components as required. The expression is also applied adjectivally to processes or apparatus for manufacturing such circuits, e.g. by mechanical or chemical treatment of conductive foil, paste or film that has been applied to an insulating base, support or substrate. printed circuit board printed circuit boards a circuit board in/on which a printed circuit is formed. Various electronic components, such as semiconductor chips, capacitors and resistors, may be mounted thereon or embedded therein, while being electrically connected to the printed circuit. Electronic components may also be formed by printing. Single-sided or double-sided printed circuit boards typically have a structure where the insulating support forms the substrate on which the conductive patterned layer(s), i.e. the printed circuit, is/are provided. Multilayer printed circuit boards have a layered structure in which conductive layers and insulating materials are laminated in the form of a substrate, and interconnections can be provided, e.g. by through-holes, vias or internal layers. PCBs may be rigid, flexible, rigid-flex (a combination of both) or stretchable.
Of 10 combined children, 8 exist in both systems.
2 codes are CPC-only extensions.
Note: 2 CPC extensions are marked as secondary classification only.
3 shared codes have differing titles between IPC and CPC.
Child Classifications
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- H05K 10/00 Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit IPC+CPC Available in IPC and CPC
- H05K 11/00 Combinations of a radio or television receiver with apparatus having a different main function IPC+CPC Available in IPC and CPC
- H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components +7 CPC IPC+CPC Available in IPC and CPC
- H05K 2201/00 Indexing scheme relating to printed circuits covered by H05K1/00 2nd only +11 CPC CPC only CPC only
- H05K 2203/00 Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 2nd only +18 CPC CPC only CPC only
- H05K 3/00 Apparatus or processes for manufacturing printed circuits +11 CPC IPC+CPC Available in IPC and CPC
- H05K 5/00 Casings, cabinets or drawers for electric apparatus +4 CPC IPC+CPC Available in IPC and CPC
- H05K 7/00 Constructional details common to different types of electric apparatus (casings, cabinets, drawers H05K5/00) +1 CPC IPC+CPC Available in IPC and CPC
- H05K 9/00 Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) +9 CPC IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,201
- PANASONIC INTELLECTUAL PROPERTY 6,828
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
- LG ELECTRONICS KR 3,564
- PANASONIC INTELLECTUAL PROPERTY JP 3,533
- SAMSUNG DISPLAY KR 3,310
- FUJI JP 2,870
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
- MURATA MANUFACTURING COMPANY JP 2,634
Top Applicants (CPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907