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DIFF Subgroup Additional Only
H05K 2203/047

Soldering with different solders, e.g. two different solders on two sides of the PCB

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Soldering or other types of metallurgic bonding > Soldering with different solders, e.g. two different solders on two sides of the PCB

Top Applicants

Top Applicants (IPC)

Class H05,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,201
  2. PANASONIC INTELLECTUAL PROPERTY 6,828
  3. SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
  4. LG ELECTRONICS KR 3,564
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,533
  6. SAMSUNG DISPLAY KR 3,310
  7. FUJI JP 2,870
  8. SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
  9. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
  10. MURATA MANUFACTURING COMPANY JP 2,634

Top Applicants (CPC)

Class H05,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907