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DIFF Subgroup Additional Only
H05K 2203/302

Bending a rigid substrate; Breaking rigid substrates by bending

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17 > Bending a rigid substrate; Breaking rigid substrates by bending