DIFF Main Group
H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
Introduced: January 2023
Of 16 combined children, 8 exist in both systems.
8 codes are CPC-only extensions.
IPC defines codes here since 2023.
Child Classifications
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- H10K 71/20 Changing the shape of the active layer in the devices, e.g. patterning since 2023 +3 CPC IPC+CPC Available in IPC and CPC
- H10K 71/30 Doping active layers, e.g. electron transporting layers since 2023 IPC+CPC Available in IPC and CPC
- H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour since 2023 +2 CPC IPC+CPC Available in IPC and CPC
- H10K 71/50 Forming devices by joining two substrates together, e.g. lamination techniques since 2023 IPC+CPC Available in IPC and CPC
- H10K 71/60 Forming conductive regions or layers, e.g. electrodes since 2023 +1 CPC IPC+CPC Available in IPC and CPC