H10N 30/057 by stacking bulk piezoelectric or electrostrictive bodies and electrodes
Introduced: January 2023
Full Title
Full titles differ between systems:
Piezoelectric or electrostrictive devices > Manufacture or treatment > Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes > by stacking bulk piezoelectric or electrostrictive bodies and electrodes
Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N39/00) > Manufacture or treatment > Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes > by stacking bulk piezoelectric or electrostrictive bodies and electrodes
No child classifications to compare. This is a leaf node in both IPC and CPC.