of semiconductor materials

Introduced: January 2026

Full Title

Formation of materials, e.g. in the shape of layers or pillars > of semiconductor materials

CPC subdivides this area 3x more granularly than IPC with 7 additional codes.

7 codes are CPC-only extensions.

IPC defines codes here since 2026.

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H10P 14/203 CPC only CPC only
H10P 14/22 using physical deposition, e.g. vacuum deposition or sputtering since 2026 IPC+CPC Available in IPC and CPC
H10P 14/24 using chemical vapour deposition [CVD] since 2026 IPC+CPC Available in IPC and CPC
H10P 14/26 using liquid deposition since 2026 +2 CPC IPC+CPC Available in IPC and CPC
H10P 14/27 +3 CPC CPC only CPC only
H10P 14/29 +3 CPC CPC only CPC only
H10P 14/32 +3 CPC CPC only CPC only
H10P 14/34 +4 CPC CPC only CPC only
H10P 14/36 +1 CPC CPC only CPC only
H10P 14/38 +3 CPC CPC only CPC only

Class H10,2013–2023, worldwide · Source: EPO PATSTAT

Class H10,2013–2023, worldwide · Source: EPO PATSTAT