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PCE
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DIFF Subgroup
H10P 14/22

using physical deposition, e.g. vacuum deposition or sputtering

Introduced: January 2026

Full Title

Formation of materials, e.g. in the shape of layers or pillars > of semiconductor materials > using physical deposition, e.g. vacuum deposition or sputtering

No child classifications to compare. This is a leaf node in both IPC and CPC.