H10P 50/262 — IPC vs CPC Diff | Patent Classification Explorer

DIFF Subgroup

H10P 50/262

Full Title

Etching of wafers, substrates or parts of devices > Dry etching; Plasma etching; Reactive-ion etching > of conductive or resistive materials

Of 1 combined children, 0 exist in both systems.

1 codes are CPC-only extensions.

This code exists only in CPC.

Diff view requires codes present in both systems.