DIFF Main Group
H10P 50/00 Etching of wafers, substrates or parts of devices
Introduced: January 2026
CPC subdivides this area 3x more granularly than IPC with 3 additional codes.
3 codes are CPC-only extensions.
IPC defines codes here since 2026.
Child Classifications
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- H10P 50/20 Dry etching; Plasma etching; Reactive-ion etching since 2026 IPC+CPC Available in IPC and CPC