H10P 50/642 — IPC vs CPC Diff | Patent Classification Explorer

DIFF Subgroup

H10P 50/642

Full Title

Etching of wafers, substrates or parts of devices > Wet etching > of semiconductor materials

Of 2 combined children, 0 exist in both systems.

2 codes are CPC-only extensions.

This code exists only in CPC.

Diff view requires codes present in both systems.