DIFF Subgroup
H10P 50/69 Full Title
Etching of wafers, substrates or parts of devices
Of 1 combined children, 0 exist in both systems.
1 codes are CPC-only extensions.
H10P 50/69 Etching of wafers, substrates or parts of devices
Of 1 combined children, 0 exist in both systems.
1 codes are CPC-only extensions.