Patent Classification Explorer PCE

DIFF Main Group

H10W 80/00

Direct bonding of chips, wafers or substrates

Introduced: January 2026

Of 6 combined children, 0 exist in both systems.

6 codes are CPC-only extensions.

Child Classifications

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H10W 80/011 +4 CPC CPC only CPC only
H10W 80/102 CPC only CPC only
H10W 80/161 +3 CPC CPC only CPC only
H10W 80/211 CPC only CPC only
H10W 80/301 +5 CPC CPC only CPC only
H10W 80/701 +4 CPC CPC only CPC only