Direct bonding of chips, wafers or substrates

Introduced: January 2026

Additional Content IPC

direct bonding bonding of two objects without the use of intervening bonding material (e.g. without solder or adhesive). Examples include: (a) direct pad-to-pad bonding; (b) direct insulator-to-insulator bonding; and (c) hybrid bonding, namely the combination of (a) and (b) above.

Of 6 combined children, 0 exist in both systems.

6 codes are CPC-only extensions.

Child Classifications

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H10W 80/011 +4 CPC CPC only CPC only
H10W 80/102 CPC only CPC only
H10W 80/161 +3 CPC CPC only CPC only
H10W 80/211 CPC only CPC only
H10W 80/301 +5 CPC CPC only CPC only
H10W 80/701 +4 CPC CPC only CPC only

Top Applicants

Top Applicants (IPC)

Class H10,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG DISPLAY KR 21,044
SAMSUNG ELECTRONICS COMPANY KR 14,774
LG DISPLAY COMPANY KR 9,454
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
BOE TECHNOLOGY GROUP COMPANY 6,845
BOE TECHNOLOGY GROUP COMPANY CN 6,806
SAMSUNG DISPLAY 6,577
LG CHEM KR 5,461
SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115

Top Applicants (CPC)

Class H10,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG DISPLAY KR 38,446
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
SAMSUNG ELECTRONICS COMPANY KR 30,059
BOE TECHNOLOGY GROUP COMPANY CN 20,304
LG DISPLAY COMPANY KR 17,772
BOE TECHNOLOGY GROUP COMPANY 15,621
SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
SAMSUNG DISPLAY 11,316
SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697