Direct bonding of chips, wafers or substrates

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

Scope Notes

Glossary: direct bonding bonding of two objects without the use of intervening bonding material (e.g. without solder or adhesive). Examples include: (a) direct pad-to-pad bonding; (b) direct insulator-to-insulator bonding; and (c) hybrid bonding, namely the combination of (a) and (b) above.