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IPC Main Group
H10W 80/00

Direct bonding of chips, wafers or substrates

Introduced: January 2026

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

Filing statistics

The most active applicants in class H10 are SAMSUNG DISPLAY (21,044 applications), SAMSUNG ELECTRONICS COMPANY (14,774 applications) and LG DISPLAY COMPANY (9,454 applications).

Source: EPO PATSTAT, worldwide filings

Additional Content

direct bonding bonding of two objects without the use of intervening bonding material (e.g. without solder or adhesive). Examples include: (a) direct pad-to-pad bonding; (b) direct insulator-to-insulator bonding; and (c) hybrid bonding, namely the combination of (a) and (b) above.

Top Applicants

Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG DISPLAY KR 21,044
  2. SAMSUNG ELECTRONICS COMPANY KR 14,774
  3. LG DISPLAY COMPANY KR 9,454
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
  5. SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
  6. BOE TECHNOLOGY GROUP COMPANY 6,845
  7. BOE TECHNOLOGY GROUP COMPANY CN 6,806
  8. SAMSUNG DISPLAY 6,577
  9. LG CHEM KR 5,461
  10. SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115