H10W GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
Introduced: January 2026
Description
H10W covers the physical packaging, interconnection architectures, connector designs, and structural elements applicable to semiconductor and solid-state devices classified under H10. This includes lead frames, bonding techniques, encapsulation materials, mounting substrates, and electrical connection schemes that are not device-type specific. The classification addresses generic constructional aspects that may apply across multiple semiconductor technologies (diodes, transistors, integrated circuits, etc.) when those aspects are not better covered by technology-specific classes.
Title
Titles differ between systems:
IPC: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS
CPC: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
Full Title
Full titles differ between systems:
GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS
GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
Additional Content IPC
via vias an electrically or thermally conductive connection that passes vertically through a layer. Examples include through-hole vias, blind vias, buried vias, and vias connecting between traces of the back-end-of-line [BEOL] metallisations.
IPC and CPC are identically structured here. All 17 subcodes exist in both systems.
2 shared codes have differing titles between IPC and CPC.
IPC defines codes here since 2026.
Child Classifications
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- H10W 10/00 Isolation regions in semiconductor bodies between components of integrated devices since 2026 +1 CPC IPC+CPC Available in IPC and CPC
- H10W 15/00 Highly-doped buried regions of integrated devices since 2026 +1 CPC IPC+CPC Available in IPC and CPC
- H10W 20/00 Interconnections in chips, wafers or substrates since 2026 +1 CPC IPC+CPC Available in IPC and CPC
- H10W 29/00 Generic parts of integrated devices, not otherwise provided for since 2026 +1 CPC IPC+CPC Available in IPC and CPC
- H10W 40/00 Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) since 2026 +1 CPC IPC+CPC Available in IPC and CPC
- H10W 42/00 Arrangements for protection of devices (arrangements for thermal protection H10W40/00) since 2026 +2 CPC IPC+CPC Available in IPC and CPC
- H10W 44/00 Electrical arrangements for controlling or matching impedance since 2026 +3 CPC IPC+CPC Available in IPC and CPC
- H10W 46/00 Marks applied to devices, e.g. for alignment or identification since 2026 +6 CPC IPC+CPC Available in IPC and CPC
- H10W 70/00 Package substrates; Interposers; Redistribution layers [RDL] since 2026 +1 CPC IPC+CPC Available in IPC and CPC
- H10W 72/00 Interconnections or connectors in packages since 2026 +8 CPC IPC+CPC Available in IPC and CPC
- H10W 76/00 Containers; Fillings or auxiliary members therefor; Seals since 2026 IPC+CPC Available in IPC and CPC
- H10W 78/00 Detachable holders for supporting packaged chips in operation since 2026 IPC+CPC Available in IPC and CPC
- H10W 80/00 Direct bonding of chips, wafers or substrates since 2026 +6 CPC IPC+CPC Available in IPC and CPC
- H10W 95/00 Packaging processes not covered by the other groups of this subclass since 2026 IPC+CPC Available in IPC and CPC
- H10W 99/00 Subject matter not provided for in other groups of this subclass since 2026 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H10,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 21,044
- SAMSUNG ELECTRONICS COMPANY KR 14,774
- LG DISPLAY COMPANY KR 9,454
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
- BOE TECHNOLOGY GROUP COMPANY 6,845
- BOE TECHNOLOGY GROUP COMPANY CN 6,806
- SAMSUNG DISPLAY 6,577
- LG CHEM KR 5,461
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115
Top Applicants (CPC)
Class H10,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 38,446
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
- SAMSUNG ELECTRONICS COMPANY KR 30,059
- BOE TECHNOLOGY GROUP COMPANY CN 20,304
- LG DISPLAY COMPANY KR 17,772
- BOE TECHNOLOGY GROUP COMPANY 15,621
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
- SAMSUNG DISPLAY 11,316
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697