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PCE
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DIFF Subgroup
H10W 90/22

the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL

Introduced: January 2026

Full Title

Package configurations > Configurations of stacked chips > the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL

No child classifications to compare. This is a leaf node in both IPC and CPC.