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IPC Main Group
B23K 1/00

Soldering, e.g. brazing, or unsoldering

Introduced: September 1968

Last revised: January 2006

Classification Context

Section:
PERFORMING OPERATIONS; TRANSPORTING
Class:
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
Subclass:
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM

Filing statistics

IPC B23K 1/00 belongs to the parent subclass B23K, which recorded 516,255 patent applications worldwide between 2013 and 2023. Annual filings grew from 24,268 in 2013 to 67,503 in 2023 (+178%). The most active applicants in class B23 are ITW (ILLINOIS TOOL WORKS) (3,407 applications), FANUC (3,120 applications) and DISCO ABRASIVE SYSTEM (2,777 applications).

Source: EPO PATSTAT, worldwide filings

Additional Content

Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods

Related Keywords

BRAZING metal

10 direct subcodes

Child Classifications

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  • B23K 1/002 Soldering by means of induction heating
  • B23K 1/005 Soldering by means of radiant energy
  • B23K 1/008 Soldering within a furnace
  • B23K 1/018 Unsoldering; Removal of melted solder or other residues
  • B23K 1/06 making use of vibrations, e.g. supersonic vibrations
  • B23K 1/08 Soldering by means of dipping in molten solder
  • B23K 1/19 taking account of the properties of the materials to be soldered
  • B23K 1/2 Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

Top Applicants

Top 10 applicants by patent filingsfor class B23, 2013–2023, worldwide · Source: EPO PATSTAT

  1. ITW (ILLINOIS TOOL WORKS) US 3,407
  2. FANUC JP 3,120
  3. DISCO ABRASIVE SYSTEM 2,777
  4. HAN'S LASER TECHNOLOGY INDUSTRY GROUP COMPANY 2,629
  5. ROBERT BOSCH DE 2,468
  6. FANUC 2,273
  7. DISCO CORPORATION JP 2,267
  8. GE (GENERAL ELECTRIC COMPANY) US 1,611
  9. CHINESE ACADEMY OF SCIENCES 1,534
  10. ISCAR IL 1,499