IPC Main Group
F28F 3/00 Plate-like or laminated elements; Assemblies of plate-like or laminated elements
Introduced: September 1968
Last revised: January 2006
Classification Context
- Section:
- MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- Class:
- HEAT EXCHANGE IN GENERAL
- Subclass:
- DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
Filing statistics
IPC F28F 3/00 belongs to the parent subclass F28F, which recorded 136,716 patent applications worldwide between 2013 and 2023. Annual filings grew from 8,338 in 2013 to 16,393 in 2023 (+97%), peaking at 17,090 applications in 2020. The most active applicants in class F28 are VALEO SYSTEMES THERMIQUES (1,902 applications), MITSUBISHI ELECTRIC CORPORATION (1,327 applications) and GREE ELECTRIC APPLIANCES (1,152 applications).
Source: EPO PATSTAT, worldwide filings
Related Keywords
PLATE(S) -like elements for heat-exchange apparatus
3 direct subcodes
Child Classifications
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- F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F 3/08 Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels
Top Applicants
Top 10 applicants by patent filingsfor class F28, 2013–2023, worldwide · Source: EPO PATSTAT
- VALEO SYSTEMES THERMIQUES FR 1,902
- MITSUBISHI ELECTRIC CORPORATION JP 1,327
- GREE ELECTRIC APPLIANCES 1,152
- MAHLE INTERNATIONAL DE 999
- ALFA LAVAL SE 960
- HANON SYSTEMS KR 917
- DENSO CORPORATION 905
- DENSO CORPORATION JP 802
- CHINESE ACADEMY OF SCIENCES 787
- XIAN THERMAL POWER RESEARCH INSTITUTE COMPANY 762