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IPC Subgroup
G06F 1/18

Packaging or power distribution

Introduced: January 1990

Last revised: January 2026

Full Title

Details not covered by groups and > Constructional details or arrangements > Packaging or power distribution

Classification Context

Section:
PHYSICS
Class:
COMPUTING OR CALCULATING; COUNTING
Subclass:
ELECTRIC DIGITAL DATA PROCESSING

Filing statistics

IPC G06F 1/18 belongs to the parent subclass G06F, which recorded 2,990,091 patent applications worldwide between 2013 and 2023. Annual filings grew from 193,009 in 2013 to 380,314 in 2023 (+97%). The most active applicants in class G06 are SAMSUNG ELECTRONICS COMPANY (66,669 applications), IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) (62,313 applications) and MICROSOFT TECHNOLOGY LICENSING (41,918 applications).

Source: EPO PATSTAT, worldwide filings

1 direct subcode

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class G06, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 66,669
  2. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,313
  3. MICROSOFT TECHNOLOGY LICENSING US 41,918
  4. GOOGLE US 32,969
  5. SGCC(STATE GRID CORPORATION OF CHINA) 30,822
  6. INTEL CORPORATION US 30,010
  7. TENCENT TECHNOLOGY (SHENZHEN) COMPANY 28,235
  8. HUAWEI TECHNOLOGIES COMPANY CN 26,079
  9. APPLE US 21,891
  10. HUAWEI TECHNOLOGIES COMPANY 20,505