Skip to content
PCE
Search Classifications
Search for IPC and CPC classification codes or keywords
IPC Subgroup
G06T 3/06

Topological mapping of higher dimensional structures onto lower dimensional surfaces

Introduced: January 2024

Full Title

Geometric image transformations in the plane of the image > Topological mapping of higher dimensional structures onto lower dimensional surfaces

Classification Context

Section:
PHYSICS
Class:
COMPUTING OR CALCULATING; COUNTING
Subclass:
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL

Filing statistics

IPC G06T 3/06 belongs to the parent subclass G06T, which recorded 689,851 patent applications worldwide between 2013 and 2023. Annual filings grew from 27,180 in 2013 to 103,590 in 2023 (+281%). The most active applicants in class G06 are SAMSUNG ELECTRONICS COMPANY (66,669 applications), IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) (62,313 applications) and MICROSOFT TECHNOLOGY LICENSING (41,918 applications).

Source: EPO PATSTAT, worldwide filings

2 direct subcodes

Child Classifications

Navigate with arrow keys, Enter to open

  • G06T 3/067 Reshaping or unfolding three-dimensional [3D] tree structures onto two-dimensional [2D] planes
  • G06T 3/073 Transforming surfaces of revolution to planar images, e.g. cylindrical surfaces to planar images

Top Applicants

Top 10 applicants by patent filingsfor class G06, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 66,669
  2. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,313
  3. MICROSOFT TECHNOLOGY LICENSING US 41,918
  4. GOOGLE US 32,969
  5. SGCC(STATE GRID CORPORATION OF CHINA) 30,822
  6. INTEL CORPORATION US 30,010
  7. TENCENT TECHNOLOGY (SHENZHEN) COMPANY 28,235
  8. HUAWEI TECHNOLOGIES COMPANY CN 26,079
  9. APPLE US 21,891
  10. HUAWEI TECHNOLOGIES COMPANY 20,505