H01C RESISTORS
Introduced: September 1968
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC ELEMENTS
- Subclass:
- RESISTORS
Description
Resistors and resistive elements used in electrical circuits and electronic devices. This subclass covers fixed and variable resistors, thermistors, varistors, and resistive films or coatings, including their construction, materials (such as carbon, wire-wound, or metal film), and manufacturing processes. Related technologies include resistor networks, resistor arrays, and hybrid resistive assemblies integrated with other components. Adjacent classes cover resistor applications within specific circuit configurations (H01L for semiconductors) and resistive heating elements designed primarily for thermal rather than electrical control purposes.
Additional Content
Glossary
adjustable mechanically adjustable
Limiting references
Apparatus or processes for filling or compressing insulating material in heating element tubes Resistors having potential barriers, e.g. field-effect resistors , Photoresistors and similar semiconductor devices in which radiation controls flow of current through the device Magnetic-field-controlled resistors and similar devices using galvano-magnetic or similar magnetic effects , Bulk negative resistance effect devices
Application references
Impedance networks
Related Keywords
8 direct subcodes
Child Classifications
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- H01C 1/00 Details
- H01C 10/00 Adjustable resistors
- H01C 11/00 Non-adjustable liquid resistors
- H01C 13/00 Resistors not provided for elsewhere
- H01C 17/00 Apparatus or processes specially adapted for manufacturing resistors
- H01C 3/00 Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven, or formed as grids
- H01C 7/00 Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C 8/00 Non-adjustable resistors consisting of loose powdered or granular conducting, or powdered or granular semi-conducting material
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634