IPC Subgroup
H01C 1/02 Housing; Enclosing; Embedding; Filling the housing or enclosure
Introduced: September 1968
Last revised: January 2006
Full Title
Details > Housing; Enclosing; Embedding; Filling the housing or enclosure
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC ELEMENTS
- Subclass:
- RESISTORS
5 direct subcodes
Child Classifications
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- H01C 1/022 the housing or enclosure being openable or separable from the resistive element
- H01C 1/024 the housing or enclosure being hermetically sealed
- H01C 1/028 the resistive element being embedded in insulation with outer enclosing sheath
- H01C 1/032 plural layers surrounding the resistive element
- H01C 1/034 the housing or enclosure being formed as coating or mould without outer sheath
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634