IPC Subgroup
H01C 1/08 Cooling, heating or ventilating arrangements
Introduced: September 1968
Last revised: January 2006
Full Title
Details > Cooling, heating or ventilating arrangements
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC ELEMENTS
- Subclass:
- RESISTORS
2 direct subcodes
Child Classifications
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- H01C 1/082 using forced fluid flow
- H01C 1/084 using self-cooling, e.g. fins, heat sinks
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634