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IPC Subgroup
H01R 13/42

Securing in a demountable manner

Introduced: September 1968

Last revised: January 2006

Full Title

Details of coupling devices of the kinds covered by groups or > Securing contact members in or to a base or case; Insulating of contact members > Securing in a demountable manner

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC ELEMENTS
Subclass:
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

Filing statistics

IPC H01R 13/42 belongs to the parent subclass H01R, which recorded 480,976 patent applications worldwide between 2013 and 2023. Annual filings grew from 29,386 in 2013 to 56,173 in 2023 (+91%). The most active applicants in class H01 are TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (43,574 applications), SAMSUNG ELECTRONICS COMPANY (42,206 applications) and LG CHEM (21,383 applications).

Source: EPO PATSTAT, worldwide filings

5 direct subcodes

Child Classifications

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  • H01R 13/422 in resilient one-piece base or case; One-piece base or case formed with resilient locking means
  • H01R 13/424 in base or case composed of a plurality of insulating parts having at least one resilient insulating part
  • H01R 13/426 by separate resilient retaining piece supported by base or case, e.g. collar
  • H01R 13/436 Securing a plurality of contact members by one locking piece

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634