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IPC Main Group
H01R 13/00

Details of coupling devices of the kinds covered by groups or

Introduced: September 1968

Last revised: January 2006

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC ELEMENTS
Subclass:
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

Related Keywords

PIN(S) forming contacts of electric couplings

14 direct subcodes

Child Classifications

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  • H01R 13/56 Means for preventing chafing or fracture of flexible leads at outlet from coupling part
  • H01R 13/6 Means for supporting coupling part when not engaged
  • H01R 13/72 Means for accommodating flexible lead within the holder

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634