IPC Subgroup
H01R 13/6591 Specific features or arrangements of connection of shield to conductive members
Introduced: January 2011
Full Title
Details of coupling devices of the kinds covered by groups or > Protective earth or shield arrangements on coupling devices > High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse] > Specific features or arrangements of connection of shield to conductive members
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC ELEMENTS
- Subclass:
- ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4 direct subcodes
Child Classifications
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- H01R 13/6592 the conductive member being a shielded cable
- H01R 13/6594 the shield being mounted on a PCB and connected to conductive members
- H01R 13/6596 the conductive member being a metal grounding panel
- H01R 13/6597 the conductive member being a contact of the connector
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634