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IPC Subgroup
H01R 24/86

Parallel contacts arranged about a common axis

Introduced: January 2011

Full Title

Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure > Parallel contacts arranged about a common axis

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC ELEMENTS
Subclass:
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

Filing statistics

IPC H01R 24/86 belongs to the parent subclass H01R, which recorded 480,976 patent applications worldwide between 2013 and 2023. Annual filings grew from 29,386 in 2013 to 56,173 in 2023 (+91%). The most active applicants in class H01 are TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (43,574 applications), SAMSUNG ELECTRONICS COMPANY (42,206 applications) and LG CHEM (21,383 applications).

Source: EPO PATSTAT, worldwide filings

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634