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IPC Main Group
H01R 24/00

Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure

Introduced: January 2000

Last revised: January 2011

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC ELEMENTS
Subclass:
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

Additional Content

Glossary

Pin pins Male contact Socket sockets Female contact

Limiting references

Contact members Securing contact members in or to a base or case; Insulating of contact members Bases; Cases Means for supporting coupling part when not engaged Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement Means for preventing, inhibiting or avoiding incorrect coupling

Application references

Specially adapted for printed circuits, flat or ribbon cables, or like structures Specially adapted for supporting apparatus

9 direct subcodes

Child Classifications

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  • H01R 24/58 Contacts spaced along longitudinal axis of engagement
  • H01R 24/84 Hermaphroditic coupling devices
  • H01R 24/86 Parallel contacts arranged about a common axis

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634