H01R 24/00 Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
Introduced: January 2000
Last revised: January 2011
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC ELEMENTS
- Subclass:
- ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
Filing statistics
IPC H01R 24/00 belongs to the parent subclass H01R, which recorded 480,976 patent applications worldwide between 2013 and 2023. Annual filings grew from 29,386 in 2013 to 56,173 in 2023 (+91%). The most active applicants in class H01 are TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (43,574 applications), SAMSUNG ELECTRONICS COMPANY (42,206 applications) and LG CHEM (21,383 applications).
Source: EPO PATSTAT, worldwide filings
Additional Content
Glossary
Pin pins Male contact Socket sockets Female contact
Limiting references
Contact members Securing contact members in or to a base or case; Insulating of contact members Bases; Cases Means for supporting coupling part when not engaged Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement Means for preventing, inhibiting or avoiding incorrect coupling
Application references
Specially adapted for printed circuits, flat or ribbon cables, or like structures Specially adapted for supporting apparatus
9 direct subcodes
Child Classifications
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- H01R 24/2 Coupling parts carrying sockets, clips or analogous contacts and secured only to wire or cable
- H01R 24/28 Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
- H01R 24/38 having concentrically or coaxially arranged contacts
- H01R 24/58 Contacts spaced along longitudinal axis of engagement
- H01R 24/6 Contacts spaced along planar side wall transverse to longitudinal axis of engagement
- H01R 24/66 with pins, blades or analogous contacts and secured to apparatus or structure, e.g. to a wall
- H01R 24/76 with sockets, clips or analogous contacts and secured to apparatus or structure, e.g. to a wall
- H01R 24/84 Hermaphroditic coupling devices
- H01R 24/86 Parallel contacts arranged about a common axis
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634