Connection setup

Introduced: January 2018

Full Title

Connection management > Connection setup

Classification Context

Section:: ELECTRICITY
Class:: ELECTRIC COMMUNICATION TECHNIQUE
Subclass:: WIRELESS COMMUNICATION NETWORKS

Filing statistics

IPC H04W 76/1 belongs to the parent subclass H04W, which recorded 1,086,704 patent applications worldwide between 2013 and 2023. Annual filings grew from 75,401 in 2013 to 101,506 in 2023 (+35%), peaking at 118,355 applications in 2021. The most active applicants in class H04 are QUALCOMM (97,396 applications), HUAWEI TECHNOLOGIES COMPANY (96,502 applications) and SAMSUNG ELECTRONICS COMPANY (86,981 applications).

Source: EPO PATSTAT, worldwide filings

6 direct subcodes

Child Classifications

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H04W 76/11 Allocation or use of connection identifiers
H04W 76/12 Setup of transport tunnels
H04W 76/14 Direct-mode setup
H04W 76/15 Setup of multiple wireless link connections
H04W 76/18 Management of setup rejection or failure
H04W 76/19 Connection re-establishment

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

QUALCOMM US 97,396
HUAWEI TECHNOLOGIES COMPANY CN 96,502
SAMSUNG ELECTRONICS COMPANY KR 86,981
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
HUAWEI TECHNOLOGIES COMPANY 55,349
LG ELECTRONICS KR 53,649
CANON 33,341
SONY CORPORATION JP 32,761
ZTE CORPORATION CN 32,274
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327