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DIFF Subgroup
H04W 76/10

Connection setup

Introduced: January 2018

Full Title

Connection management > Connection setup

IPC and CPC are identically structured here. All 6 subcodes exist in both systems.

IPC defines codes here since 2018.

Child Classifications

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  • H04W 76/11 Allocation or use of connection identifiers since 2018 IPC+CPC Available in IPC and CPC
  • H04W 76/12 Setup of transport tunnels since 2018 IPC+CPC Available in IPC and CPC
  • H04W 76/14 Direct-mode setup since 2018 IPC+CPC Available in IPC and CPC
  • H04W 76/18 Management of setup rejection or failure since 2018 IPC+CPC Available in IPC and CPC
  • H04W 76/19 Connection re-establishment since 2018 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H04,2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 97,396
  2. HUAWEI TECHNOLOGIES COMPANY CN 96,502
  3. SAMSUNG ELECTRONICS COMPANY KR 86,981
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
  5. HUAWEI TECHNOLOGIES COMPANY 55,349
  6. LG ELECTRONICS KR 53,649
  7. CANON 33,341
  8. SONY CORPORATION JP 32,761
  9. ZTE CORPORATION CN 32,274
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327

Top Applicants (CPC)

Class H04,2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498