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IPC Subgroup
H10F 39/9

Assemblies of multiple devices

Introduced: January 2025

Last revised: January 2026

Full Title

Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays > Assemblies of multiple devices

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

1 direct subcode

Child Classifications

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  • H10F 39/95 comprising at least one integrated device covered by group , e.g. comprising integrated image sensors

Top Applicants

Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG DISPLAY KR 21,044
  2. SAMSUNG ELECTRONICS COMPANY KR 14,774
  3. LG DISPLAY COMPANY KR 9,454
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
  5. SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
  6. BOE TECHNOLOGY GROUP COMPANY 6,845
  7. BOE TECHNOLOGY GROUP COMPANY CN 6,806
  8. SAMSUNG DISPLAY 6,577
  9. LG CHEM KR 5,461
  10. SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115