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IPC Subgroup
H10N 30/088

by cutting or dicing

Introduced: January 2023

Full Title

Piezoelectric or electrostrictive devices > Manufacture or treatment > Shaping or machining of piezoelectric or electrostrictive bodies > by machining > by cutting or dicing

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR