by sawing, e.g. using revolving or reciprocating blades

Full Title

Cutting or separating of wafers, substrates or parts of devices > by sawing, e.g. using revolving or reciprocating blades

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS