Cutting or separating of wafers, substrates or parts of devices

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS

Child Classifications

Navigate with arrow keys, Enter to open

• H10P 54/2 by laser cutting
• H10P 54/3 by forming weakened zones for subsequent cutting or separating, e.g. by laser treatment or by ion implantation
• H10P 54/4 by sawing, e.g. using revolving or reciprocating blades
• H10P 54/5 by scoring, breaking or cleaving
• H10P 54/9 Auxiliary processes or arrangements