H10P GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS
Introduced: January 2026
Classification Context
- Section:
- ELECTRICITY
- Class:
- SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Subclass:
- GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS
Description
H10P covers generic manufacturing and treatment processes applicable across the broader category of semiconductor and solid-state electronic devices classified in H10. This subclass encompasses general-purpose fabrication techniques, processing methods, and apparatus that are not device-type specific but serve multiple device categories within H10. Examples include wafer preparation, doping processes, thermal treatment, surface modifications, and testing procedures that apply broadly to semiconductor manufacture. Classification here is appropriate when the invention relates to process steps or equipment of general applicability rather than techniques tied to particular device architectures (which would be classified in more specific H10 subclasses).
Scope Notes
Application references: Electronic memory devices Inorganic electric semiconductor devices Inorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation Inorganic light-emitting semiconductor devices having potential barriers Organic electric solid-state devices Electric solid-state devices not otherwise provided for
Related Keywords
17 direct subcodes
Child Classifications
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- H10P 10/00 Bonding of wafers, substrates or parts of devices
- H10P 14/00 Formation of materials, e.g. in the shape of layers or pillars
- H10P 30/00 Ion implantation into wafers, substrates or parts of devices
- H10P 32/00 Diffusion of dopants within, into, or out of wafers, substrates or parts of devices
- H10P 34/00 Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
- H10P 36/00 Gettering within semiconductor bodies
- H10P 50/00 Etching of wafers, substrates or parts of devices
- H10P 52/00 Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P 54/00 Cutting or separating of wafers, substrates or parts of devices
- H10P 56/00 Debonding of wafers, substrates or parts of devices
- H10P 58/00 Singulating wafers or substrates into multiple chips, i.e. dicing
- H10P 70/00 Cleaning of wafers, substrates or parts of devices
- H10P 72/00 Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P 74/00 Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P 76/00 Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P 90/00 Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P 95/00 Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass