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CPC Class Not Allocatable
B33

ADDITIVE MANUFACTURING TECHNOLOGY

Description

B33 covers processes and machines for manufacturing objects by successive addition of material layers, including 3D printing, rapid prototyping, and related technologies. This class encompasses various additive manufacturing methods such as stereolithography, selective laser sintering, fused deposition modeling, and inkjet-based printing systems, along with the apparatus, materials handling, and post-processing techniques employed in these processes. It addresses both the equipment design and operational methods for building three-dimensional structures from digital models, as well as specialized materials and processing parameters specific to additive manufacturing applications.

1 direct subcode

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Top Applicants

Top 10 applicants by patent filings, 2013–2023, worldwide · Source: EPO PATSTAT

  1. HEWLETT-PACKARD DEVELOPMENT COMPANY US 4,417
  2. GE (GENERAL ELECTRIC COMPANY) US 2,451
  3. SIEMENS DE 1,136
  4. XEROX CORPORATION US 991
  5. BOEING COMPANY US 707
  6. SEIKO EPSON CORPORATION 672
  7. EOSELECTRO OPTICAL SYSTEMS DE 662
  8. GE (GENERAL ELECTRIC COMPANY) 659
  9. KINPO ELECTRONICS TW 621
  10. XYZPRINTING TW 618