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CPC Subclass Not Allocatable
B33Y

ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING

Description

B33Y covers additive manufacturing processes that build three-dimensional objects through successive deposition, agglomeration, or layering of material. This subclass encompasses technologies including 3D printing, stereolithography, selective laser sintering, and related layer-by-layer fabrication methods. The scope extends to apparatus, machines, process parameters, material handling systems, and post-processing techniques specific to additive manufacturing operations. This classification excludes non-additive manufacturing methods (such as subtractive machining or forming) and addresses the technical implementation of 3D object construction rather than the design or composition of the final products themselves.

7 direct subcodes

Child Classifications

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  • B33Y 10/00 Processes of additive manufacturing
  • B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor
  • B33Y 80/00 Products made by additive manufacturing
  • B33Y 99/00 Subject matter not provided for in other groups of this subclass

Top Applicants

Top 10 applicants by patent filingsfor class B33, 2013–2023, worldwide · Source: EPO PATSTAT

  1. HEWLETT-PACKARD DEVELOPMENT COMPANY US 4,417
  2. GE (GENERAL ELECTRIC COMPANY) US 2,451
  3. SIEMENS DE 1,136
  4. XEROX CORPORATION US 991
  5. BOEING COMPANY US 707
  6. SEIKO EPSON CORPORATION 672
  7. EOSELECTRO OPTICAL SYSTEMS DE 662
  8. GE (GENERAL ELECTRIC COMPANY) 659
  9. KINPO ELECTRONICS TW 621
  10. XYZPRINTING TW 618