B33Y ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
Description
B33Y covers additive manufacturing processes that build three-dimensional objects through successive deposition, agglomeration, or layering of material. This subclass encompasses technologies including 3D printing, stereolithography, selective laser sintering, and related layer-by-layer fabrication methods. The scope extends to apparatus, machines, process parameters, material handling systems, and post-processing techniques specific to additive manufacturing operations. This classification excludes non-additive manufacturing methods (such as subtractive machining or forming) and addresses the technical implementation of 3D object construction rather than the design or composition of the final products themselves.
Filing statistics
CPC subclass B33Y recorded 150,610 patent applications worldwide between 2013 and 2023. Annual filings grew from 2,518 in 2013 to 13,707 in 2023 (+444%), peaking at 19,243 applications in 2020. The most active applicants in class B33 are HEWLETT-PACKARD DEVELOPMENT COMPANY (4,417 applications), GE (GENERAL ELECTRIC COMPANY) (2,451 applications) and SIEMENS (1,136 applications).
Source: EPO PATSTAT, worldwide filings
7 direct subcodes
Child Classifications
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- B33Y 10/00 Processes of additive manufacturing
- B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor
- B33Y 40/00 Auxiliary operations or equipment, e.g. for material handling
- B33Y 50/00 Data acquisition or data processing for additive manufacturing
- B33Y 70/00 Materials specially adapted for additive manufacturing
- B33Y 80/00 Products made by additive manufacturing
- B33Y 99/00 Subject matter not provided for in other groups of this subclass
Top Applicants
Top 10 applicants by patent filingsfor class B33, 2013–2023, worldwide · Source: EPO PATSTAT
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 4,417
- GE (GENERAL ELECTRIC COMPANY) US 2,451
- SIEMENS DE 1,136
- XEROX CORPORATION US 991
- BOEING COMPANY US 707
- SEIKO EPSON CORPORATION 672
- EOSELECTRO OPTICAL SYSTEMS DE 662
- GE (GENERAL ELECTRIC COMPANY) 659
- KINPO ELECTRONICS TW 621
- XYZPRINTING TW 618