B33Y ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
Description
B33Y covers additive manufacturing processes that build three-dimensional objects through successive deposition, agglomeration, or layering of material. This subclass encompasses technologies including 3D printing, stereolithography, selective laser sintering, and related layer-by-layer fabrication methods. The scope extends to apparatus, machines, process parameters, material handling systems, and post-processing techniques specific to additive manufacturing operations. This classification excludes non-additive manufacturing methods (such as subtractive machining or forming) and addresses the technical implementation of 3D object construction rather than the design or composition of the final products themselves.
7 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
- B33Y 10/00 Processes of additive manufacturing
- B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor
- B33Y 40/00 Auxiliary operations or equipment, e.g. for material handling
- B33Y 50/00 Data acquisition or data processing for additive manufacturing
- B33Y 70/00 Materials specially adapted for additive manufacturing
- B33Y 80/00 Products made by additive manufacturing
- B33Y 99/00 Subject matter not provided for in other groups of this subclass
Top Applicants
Top 10 applicants by patent filingsfor class B33, 2013–2023, worldwide · Source: EPO PATSTAT
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 4,417
- GE (GENERAL ELECTRIC COMPANY) US 2,451
- SIEMENS DE 1,136
- XEROX CORPORATION US 991
- BOEING COMPANY US 707
- SEIKO EPSON CORPORATION 672
- EOSELECTRO OPTICAL SYSTEMS DE 662
- GE (GENERAL ELECTRIC COMPANY) 659
- KINPO ELECTRONICS TW 621
- XYZPRINTING TW 618