B33 ADDITIVE MANUFACTURING TECHNOLOGY
Description
B33 covers processes and machines for manufacturing objects by successive addition of material layers, including 3D printing, rapid prototyping, and related technologies. This class encompasses various additive manufacturing methods such as stereolithography, selective laser sintering, fused deposition modeling, and inkjet-based printing systems, along with the apparatus, materials handling, and post-processing techniques employed in these processes. It addresses both the equipment design and operational methods for building three-dimensional structures from digital models, as well as specialized materials and processing parameters specific to additive manufacturing applications.
IPC and CPC are identically structured here. All 1 subcodes exist in both systems.
IPC defines codes here since 2015.
Child Classifications
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- B33Y ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING heading since 2015 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
2013–2023, worldwide · Source: EPO PATSTAT
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 3,558
- GE (GENERAL ELECTRIC COMPANY) US 1,721
- SEIKO EPSON CORPORATION 810
- XEROX CORPORATION US 787
- CHINESE ACADEMY OF SCIENCES 746
- SIEMENS DE 679
- RICOH COMPANY 624
- XIAN JIAOTONG UNIVERSITY 563
- HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY 550
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY 522
Top Applicants (CPC)
2013–2023, worldwide · Source: EPO PATSTAT
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 4,417
- GE (GENERAL ELECTRIC COMPANY) US 2,451
- SIEMENS DE 1,136
- XEROX CORPORATION US 991
- BOEING COMPANY US 707
- SEIKO EPSON CORPORATION 672
- EOSELECTRO OPTICAL SYSTEMS DE 662
- GE (GENERAL ELECTRIC COMPANY) 659
- KINPO ELECTRONICS TW 621
- XYZPRINTING TW 618