MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00)

Description

B81B encompasses micro-scale mechanical devices and integrated systems fabricated using microstructural technology, including microelectromechanical systems (MEMS), microsensors, and microactuators. This subclass covers devices with moving or functional mechanical components at the micrometer scale, such as micro-switches, micro-pumps, micro-valves, and resonators, along with their structural design and fabrication approaches. Applications include accelerometers, pressure sensors, optical MEMS (mirrors, shutters), and inertial measurement devices. Related manufacturing processes and assembly techniques for microstructural systems are also included, while pure electronic or photonic components without mechanical function are classified elsewhere.

Filing statistics

CPC subclass B81B recorded 28,559 patent applications worldwide between 2013 and 2023. Annual filings declined from 2,310 in 2013 to 2,198 in 2023 (-5%), peaking at 2,988 applications in 2018. The most active applicants in class B81 are ROBERT BOSCH (1,976 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (788 applications) and INFINEON TECHNOLOGIES (759 applications).

Source: EPO PATSTAT, worldwide filings