B81B MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00)
Description
B81B encompasses micro-scale mechanical devices and integrated systems fabricated using microstructural technology, including microelectromechanical systems (MEMS), microsensors, and microactuators. This subclass covers devices with moving or functional mechanical components at the micrometer scale, such as micro-switches, micro-pumps, micro-valves, and resonators, along with their structural design and fabrication approaches. Applications include accelerometers, pressure sensors, optical MEMS (mirrors, shutters), and inertial measurement devices. Related manufacturing processes and assembly techniques for microstructural systems are also included, while pure electronic or photonic components without mechanical function are classified elsewhere.
7 direct subcodes
Child Classifications
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- B81B 1/00 Devices without movable or flexible elements, e.g. microcapillary devices
- B81B 2201/00 Specific applications of microelectromechanical systems
- B81B 2203/00 Basic microelectromechanical structures
- B81B 2207/00 Microstructural systems or auxiliary parts thereof
- B81B 3/00 Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (B81B5/00 takes precedence)
- B81B 5/00 Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
- B81B 7/00 Microstructural systems;
Top Applicants
Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297