CPC Main Group Additional Only
B81B 2207/00 Microstructural systems or auxiliary parts thereof
7 direct subcodes
Child Classifications
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- B81B 2207/01 comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B 2207/03 Electronic circuits for micromechanical devices which are not application specific, e.g. for controlling, power supplying, testing, protecting
- B81B 2207/05 Arrays
- B81B 2207/07 Interconnects
- B81B 2207/09 Packages
- B81B 2207/11 Structural features, others than packages, for protecting a device against environmental influences
- B81B 2207/99 Microstructural systems or auxiliary parts thereof not provided for in B81B2207/01 - B81B2207/115
Top Applicants
Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297