Microstructural systems or auxiliary parts thereof

Filing statistics

CPC B81B 2207/00 belongs to the parent subclass B81B, which recorded 28,559 patent applications worldwide between 2013 and 2023. Annual filings declined from 2,310 in 2013 to 2,198 in 2023 (-5%), peaking at 2,988 applications in 2018. The most active applicants in class B81 are ROBERT BOSCH (1,976 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (788 applications) and INFINEON TECHNOLOGIES (759 applications).

Source: EPO PATSTAT, worldwide filings

7 direct subcodes

Child Classifications

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B81B 2207/01 comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
B81B 2207/03 Electronic circuits for micromechanical devices which are not application specific, e.g. for controlling, power supplying, testing, protecting
B81B 2207/05 Arrays
B81B 2207/07 Interconnects
B81B 2207/09 Packages
B81B 2207/11 Structural features, others than packages, for protecting a device against environmental influences
B81B 2207/99 Microstructural systems or auxiliary parts thereof not provided for in B81B2207/01 - B81B2207/115

Top Applicants

Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT

ROBERT BOSCH DE 1,976
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
INFINEON TECHNOLOGIES DE 759
CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
STMICROELECTRONICS IT 526
INVENSENSE US 430
MURATA MANUFACTURING COMPANY JP 418
SEIKO EPSON CORPORATION 338
CHINESE ACADEMY OF SCIENCES 338
FRAUNHOFER DE 297