B81B MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00)
Introduced: January 2000
Description
B81B encompasses micro-scale mechanical devices and integrated systems fabricated using microstructural technology, including microelectromechanical systems (MEMS), microsensors, and microactuators. This subclass covers devices with moving or functional mechanical components at the micrometer scale, such as micro-switches, micro-pumps, micro-valves, and resonators, along with their structural design and fabrication approaches. Applications include accelerometers, pressure sensors, optical MEMS (mirrors, shutters), and inertial measurement devices. Related manufacturing processes and assembly techniques for microstructural systems are also included, while pure electronic or photonic components without mechanical function are classified elsewhere.
Title
Titles differ between systems:
IPC: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
CPC: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00)
Full Title
Full titles differ between systems:
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00)
Additional Content IPC
Glossary
microelectronic device microelectronic devices any kind of electronic device that has at least one essential operational component not visible without the use of an optical microscope. microoptical device microoptical devices any kind of optical device that has at least one essential operational component not visible without the use of an optical microscope. microsized having a dimension not visible without the use of an optical microscope (e.g. typically within the range of 10 -4 to 10 -7 meters). structural function structural functions the effect of structural features of a microstructure on the mechanical properties of media in contact with the microstructure (e.g. directing of a sampled fluid's flow).
Limiting references
Products that are essentially two-dimensional [2D] layered structures Atomic scale structures produced by manipulation of single atoms or molecules Microoptical devices per se Semiconductors or other solid-state devices per se or combined with other devices formed on a common substrate
Application references
Microcapsules for medicinal preparations Micromanipulators Micromanipulators combined with microscopes Magnetic heads used with record carriers for information storage Waveguide microstrips
Of 7 combined children, 4 exist in both systems.
3 codes are CPC-only extensions.
Note: 3 CPC extensions are marked as secondary classification only.
2 shared codes have differing titles between IPC and CPC.
Child Classifications
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- B81B 1/00 Devices without movable or flexible elements, e.g. microcapillary devices since 2000 +2 CPC IPC+CPC Available in IPC and CPC
- B81B 2201/00 Specific applications of microelectromechanical systems 2nd only +11 CPC CPC only CPC only
- B81B 3/00 Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (B81B5/00 takes precedence) since 2000 +6 CPC IPC+CPC Available in IPC and CPC
- B81B 5/00 Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements since 2000 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class B81,2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 2,338
- INFINEON TECHNOLOGIES DE 702
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 691
- CHINESE ACADEMY OF SCIENCES 508
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 507
- SEIKO EPSON CORPORATION 484
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 439
- INVENSENSE US 378
- STMICROELECTRONICS IT 365
- FRAUNHOFER DE 337
Top Applicants (CPC)
Class B81,2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297