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PCE
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CPC Subgroup Additional Only
B81B 2207/11

Structural features, others than packages, for protecting a device against environmental influences

Full Title

Microstructural systems or auxiliary parts thereof > Structural features, others than packages, for protecting a device against environmental influences

1 direct subcode

Child Classifications

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  • B81B 2207/115 Protective layers applied directly to the device before packaging

Top Applicants

Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT

  1. ROBERT BOSCH DE 1,976
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
  3. INFINEON TECHNOLOGIES DE 759
  4. CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
  5. STMICROELECTRONICS IT 526
  6. INVENSENSE US 430
  7. MURATA MANUFACTURING COMPANY JP 418
  8. SEIKO EPSON CORPORATION 338
  9. CHINESE ACADEMY OF SCIENCES 338
  10. FRAUNHOFER DE 297