CPC Subgroup Additional Only
B81C 2201/0174 for making multi-layered devices, film deposition or growing
Full Title
Manufacture or treatment of microstructural devices or systems > in or on a substrate > for making multi-layered devices, film deposition or growing
6 direct subcodes
Child Classifications
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- B81C 2201/0176 Chemical vapour Deposition
- B81C 2201/0181 Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology
- B81C 2201/0183 Selective deposition
- B81C 2201/019 Bonding or gluing multiple substrate layers
- B81C 2201/0191 Transfer of a layer from a carrier wafer to a device wafer
- B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
Top Applicants
Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297