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CPC Subgroup Additional Only
B81C 2203/0742

Interleave, i.e. simultaneously forming the micromechanical structure and the CMOS circuit

Full Title

Forming microstructural systems > Integrating an electronic processing unit with a micromechanical structure > Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure > Interleave, i.e. simultaneously forming the micromechanical structure and the CMOS circuit

Top Applicants

Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT

  1. ROBERT BOSCH DE 1,976
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
  3. INFINEON TECHNOLOGIES DE 759
  4. CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
  5. STMICROELECTRONICS IT 526
  6. INVENSENSE US 430
  7. MURATA MANUFACTURING COMPANY JP 418
  8. SEIKO EPSON CORPORATION 338
  9. CHINESE ACADEMY OF SCIENCES 338
  10. FRAUNHOFER DE 297