Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure

Full Title

Forming microstructural systems > Integrating an electronic processing unit with a micromechanical structure > Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure

Child Classifications

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• B81C 2203/0714 Forming the micromechanical structure with a CMOS process
• B81C 2203/0721 Forming the micromechanical structure with a low-temperature process (B81C2203/0735 takes precedence)
• B81C 2203/0728 Pre-CMOS, i.e. forming the micromechanical structure before the CMOS circuit
• B81C 2203/0735 Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
• B81C 2203/0742 Interleave, i.e. simultaneously forming the micromechanical structure and the CMOS circuit
• B81C 2203/075 the electronic processing unit being integrated into an element of the micromechanical structure
• B81C 2203/0757 Topology for facilitating the monolithic integration