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CPC Subgroup Additional Only
B81C 2203/0757

Topology for facilitating the monolithic integration

Full Title

Forming microstructural systems > Integrating an electronic processing unit with a micromechanical structure > Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure > Topology for facilitating the monolithic integration

3 direct subcodes

Child Classifications

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  • B81C 2203/0764 Forming the micromechanical structure in a groove
  • B81C 2203/0771 Stacking the electronic processing unit and the micromechanical structure
  • B81C 2203/0778 Topology for facilitating the monolithic integration not provided for in B81C2203/0764 - B81C2203/0771

Top Applicants

Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT

  1. ROBERT BOSCH DE 1,976
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
  3. INFINEON TECHNOLOGIES DE 759
  4. CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
  5. STMICROELECTRONICS IT 526
  6. INVENSENSE US 430
  7. MURATA MANUFACTURING COMPANY JP 418
  8. SEIKO EPSON CORPORATION 338
  9. CHINESE ACADEMY OF SCIENCES 338
  10. FRAUNHOFER DE 297