CPC Subgroup Additional Only
C04B 2237/86 Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
Full Title
Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating > Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating > Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
Top Applicants
Top 10 applicants by patent filingsfor class C04, 2013–2023, worldwide · Source: EPO PATSTAT
- HALLIBURTON ENERGY SERVICES GROUP US 2,158
- CHINESE ACADEMY OF SCIENCES 1,569
- NGK INSULATORS JP 1,504
- SIKA TECHNOLOGY CH 1,181
- CORNING US 974
- WUHAN UNIVERSITY OF TECHNOLOGY 926
- UNITED STATES GYPSUM COMPANY US 882
- GE (GENERAL ELECTRIC COMPANY) US 828
- MITSUBISHI MATERIALS CORPORATION JP 792
- SAUDI ARABIAN OIL COMPANY SA 686