CPC Subgroup
C23C 14/0057 Full Title
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
Filing statistics
CPC C23C 14/0057 belongs to the parent subclass C23C, which recorded 264,425 patent applications worldwide between 2013 and 2023. Annual filings grew from 19,173 in 2013 to 23,243 in 2023 (+21%), peaking at 27,713 applications in 2020. The most active applicants in class C23 are APPLIED MATERIALS (10,596 applications), TOKYO ELECTRON (5,229 applications) and LAM RESEARCH CORPORATION (3,622 applications).
Source: EPO PATSTAT, worldwide filings
Top Applicants
Top 10 applicants by patent filingsfor class C23, 2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 10,596
- TOKYO ELECTRON JP 5,229
- LAM RESEARCH CORPORATION US 3,622
- NIPPON STEEL CORPORATION JP 3,171
- JFE STEEL JP 3,128
- ASM IP HOLDING NL 2,722
- ARCELORMITTAL LU 2,481
- TOKYO ELECTRON 2,359
- APPLIED MATERIALS 2,284
- CHINESE ACADEMY OF SCIENCES 2,110