CPC Main Group
C23C 18/00 Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
4 direct subcodes
Child Classifications
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- C23C 18/02 by thermal decomposition
- C23C 18/14 Decomposition by irradiation, e.g. photolysis, particle radiation
- C23C 18/16 by reduction or substitution, e.g. electroless plating (C23C18/54 takes precedence)
- C23C 18/54 Contact plating, i.e. electroless electrochemical plating
Top Applicants
Top 10 applicants by patent filingsfor class C23, 2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 10,596
- TOKYO ELECTRON JP 5,229
- LAM RESEARCH CORPORATION US 3,622
- NIPPON STEEL CORPORATION JP 3,171
- JFE STEEL JP 3,128
- ASM IP HOLDING NL 2,722
- ARCELORMITTAL LU 2,481
- TOKYO ELECTRON 2,359
- APPLIED MATERIALS 2,284
- CHINESE ACADEMY OF SCIENCES 2,110