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CPC Subgroup
C23C 18/52

using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Full Title

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating > by reduction or substitution, e.g. electroless plating (C23C18/54 takes precedence) > using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Top Applicants

Top 10 applicants by patent filingsfor class C23, 2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110